Functional features
The LY-1919 diamond laser processing integrated machine is a new processing method developed for processing polycrystalline diamond to replace traditional cylindrical grinding, end face grinding, chamfering and other grinding processes. It is also known as a laser grinding machine, laser thinning machine, etc. This equipment adopts a fully automated design, including an automatic loading and unloading system, laser processing system, online detection system, automated operation system and other mechanical structures essential for machine tools. This equipment can replace the rough and fine grinding processes of traditional diamond grinding technology, with a significant increase in efficiency. It also has the characteristics of no consumables and environmental friendliness, which can save a lot of usage and labor costs for users.
Industry application
The application of this industry is very extensive, . It can be used for grinding the diamond surface of PCD blade, end face grinding of PCD composite sheet, external cylindrical grinding, chamfering, etc., and can also be used for precise cutting of some materials.
Technical paramete
Laser output power | Fiber laser QCW450W |
Repeat frequency | 1~2000KHz |
Pulse width | 10-10000μs |
Type of cooling | Natural air cooling |
Processing method | Laser cutting head |
Laser processing range | ≤φ80mm |
Heat influence range | ≤0.03mm |
Automatic loading and unloading system | Module pneumatic gripper + automatic feeding bin |
Table TravelX,Y,Z | X,Y,Z 300mm*100mm*150mm |
Repeat positioning accuracy | ±0.01mm |
The largest load | 15kg |
Working time | >24h |
Supply voltage | ~220V 50Hz |
Rated power | 2.0KW |
External dimension | 1555mm(L)*1000mm(W)*1710mm(H) |
Weight | 600kg |
Keywords:
LY-1919 Diamond Laser Processing Integrated Machine
Product Category
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