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Laser precision perforation technology has achieved mass production application in the ceramic substrate field.
2025-12-16
Laser precision perforation technology, with its high precision, high efficiency, and non-contact processing characteristics, has become the core process for achieving mass production applications in the ceramic substrate field. By focusing a high-power-density laser beam, this technology locally melts and vaporizes the surface of ceramic materials, creating micrometer-scale holes and overcoming the processing bottlenecks traditionally encountered in mechanical drilling—bottlenecks caused by the high hardness and brittleness of ceramic materials.
In mass-production applications, laser drilling demonstrates significant advantages. First, the machining accuracy can reach ±3 μm, and the hole diameter range covers from 0.003 mm to 0.5 mm, meeting the demands of high-density interconnections—for example, in LED chip packaging substrates and heat-dissipating holes for power semiconductors. Second, non-contact processing eliminates mechanical stress-induced substrate cracking, boosting the yield rate to over 99%, making it particularly suitable for processing ultra-thin ceramic substrates as thin as 0.25 mm. Third, the equipment supports simultaneous multi-hole processing at a speed of up to 100 holes per second; when integrated with automated production lines, it enables 24-hour continuous production, with a single-line daily capacity exceeding 100,000 pieces.
In terms of technological adaptability, laser drilling can flexibly process mainstream ceramic materials such as alumina, aluminum nitride, and silicon nitride, and supports the fabrication of complex hole types including round holes, blind holes, and inclined holes. For example, in the production of 5G base station filters, laser drilling technology has enabled the mass production of micro-holes with diameters as small as 0.1 mm, helping to reduce the product volume by 40%. With the introduction of new light sources such as ultraviolet lasers and picosecond lasers, the heat-affected zone has been further reduced to below 5 μm, providing critical technical support for the large-scale application of ceramic substrates in high-end fields like aerospace and new-energy vehicles.
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